OLED/LCD dry engraving process Lower electrode
Widely used in semiconductor, panel display, solar photovoltaic and other vacuum equipment environment or atmospheric environment.
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Semiconductor Etching Processes Key Components Silicon Parts / Gasket
It is the main component of the vacuum chamber in the semiconductor etching process LAM / TEL / AMEC equipment.
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Yttrium oxide, aluminium oxide spray powder, ceramic powder
Powder raw materials for plasma coating of all parts of semiconductor/liquid crystal panel etching process, and ceramic parts for vacuum chamber of semiconductor/liquid crystal panel;
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HTCC High Temperature Sintered Ceramics
The products have broad applications in optical communication, microwave communication, industrial laser, automotive electronics and consumer electronics.
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Through the electrostatic adsorption effect to fix the wafer, its advantage lies in the adsorption effect is uniformly distributed on the surface of the wafer, the wafer will not warp and deform, the adsorption force is continuous and stable, which can ensure the processing accuracy of the wafer; electrostatic suction cups on the wafer contamination of a small amount of the wafer, the wafer does not hurt, and can be applied to the high-vacuum environment.
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Utilising rare earth (yttrium and fluorine) plasma coatings, the inside of the vacuum chamber ensures stability, resistance to heat and chemicals, resistance to plasma, and reduction of fine dust.
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