Product

Product


Plasma layer



Utilising rare earth (yttrium and fluorine) plasma coatings, the inside of the vacuum chamber ensures stability, resistance to heat and chemicals, resistance to plasma, and reduction of fine dust.
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Model

Precision surface treatment of all parts of the etching process for semiconductors / liquid crystal panels (plasma coating AMAT SYM3, PRODUCER, DPS2 / LAM KIYO HX,FX / TEL VIGUS , DRM, SCCM), vacuum chambers of all equipment for all processes for semiconductors / liquid crystal panels.

Application Direction

Improvement and optimisation of plasma coating materials to increase chip manufacturing yields and reduce damage.

Product Features

Using rare earth (yttrium and fluorine) plasma coating, the inside of the vacuum chamber ensures stability, heat and chemical resistance, plasma resistance, and reduction of fine dust.

Product use
It is used to optimise the whole environment in the vacuum chamber of etching equipment, to make the life of vacuum chamber components longer, and to prevent plasma corrosion of parts.

 

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