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HTCC High Temperature Sintered Ceramics



The products have broad applications in optical communication, microwave communication, industrial laser, automotive electronics and consumer electronics.
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  • The products have broad applications in optical communication, microwave communication, industrial laser, automotive electronics and consumer electronics.
    HCUT has a full set of multi-layer ceramic shell manufacturing technology, including raw material preparation, casting, punching, punching, metallisation printing, lamination, hot cutting, sintering, nickel plating, brazing, gold plating and other technologies.
    Line width/line pitch: 75um
    Coefficient of thermal expansion: 6.85×10-6/°C (25-300°C)
    Dielectric constant: 9.4 (@1MHz)
    Dielectric loss: ≤0.0007 (@1MHz)
    Flexural strength: ≥350Mpa

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