Product
OLED/LCD dry engraving process Lower electrode
Widely used in semiconductor, panel display, solar photovoltaic and other vacuum equipment environment or atmospheric environment.
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Semiconductor Etching Processes Key Components Silicon Parts / Gasket
It is the main component of the vacuum chamber in the semiconductor etching process LAM / TEL / AMEC equipment.
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Through the electrostatic adsorption effect to fix the wafer, its advantage lies in the adsorption effect is uniformly distributed on the surface of the wafer, the wafer will not warp and deform, the adsorption force is continuous and stable, which can ensure the processing accuracy of the wafer; electrostatic suction cups on the wafer contamination of a small amount of the wafer, the wafer does not hurt, and can be applied to the high-vacuum environment.
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