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Integrated Circuit Chip Packaging Overview
Release time:
2024-01-31 09:38
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Packaging concept
Narrow sense: the use of film technology and microfabrication technology, the chip and other elements in the frame or substrate layout, paste fixed and connected, lead to terminals and through the plastic insulation medium potting fixed, constituting the overall three-dimensional structure of the process.
Broad sense: the package body and the substrate connection and fixation, assembly into a complete system or electronic equipment, and to ensure that the whole system comprehensive performance of the project.
Chip packaging to achieve the function
1、Transmit function; 2、Transmit circuit signal; 3、Provide heat dissipation path; 4、Structure protection and support.
Packaging engineering technology level
Packaging engineering begins after the integrated circuit chip is made, including the integrated circuit chip paste fixed, interconnection, packaging, sealing protection, connection with the circuit board, system combination, until the final product before the completion of all the processes.
The first level: also known as the chip level of packaging, refers to the integrated circuit chip and packaging substrate or pin frame between the paste fixed, circuit wiring and packaging protection process, so that it becomes easy to pick up and place the transport, and can be assembled with the next level of connection of the module (assembly) components.
The second level: several of the first level of completion of the package and other electronic components to form - a circuit card process. Third level: The process of combining several circuit cards assembled in second level packages into a component or subsystem on a main circuit board.
Fourth level: the process of assembling several subsystems into a complete electronic product.
On chip. On the integrated circuit components between the wiring process is also known as the zero level level of packaging, so packaging engineering can also be distinguished by five levels
Classification of packaging
1, according to the number of packaged integrated circuit chips: single chip package (scP) and multi-chip package (MCP);
2, according to the sealing material: polymer materials (plastics) and ceramics;
3, according to the device and the circuit board interconnection mode: pin insertion type (PTH) and surface mount (SMT) 4, according to the pin distribution pattern: single-side pins, double-side pins, four-side pins and bottom pins;
SMT devices have L-type, J-type and I-type metal pins.
SIP :single-row package SQP: miniaturised package MCP: metal can package DIP: dual-row package CSP: chip size package QFP: four-sided flat package PGA: dot matrix package BGA: ball grid array package LCCC: leadless ceramic chip carrier
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