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Developments in Packaging Technology
Release time:
2024-01-31 09:37
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The earliest integrated circuits used ceramic flat packages, which continued to be used by the military for many years because of reliability and small size. Commercial circuit packages soon shifted to dual in-line packages, starting with ceramic and then plastic.In the 1980s, the pins of VLSI circuits exceeded the application limitations of DIP packages, eventually leading to the advent of pin grid arrays and chip carriers.
Surface mount packages appeared in the early 1980s and became popular later in that decade. It uses a finer pin pitch and a gull-wing or J-shaped pin shape. The Small-Outline Integrated Circuit (SOIC), for example, has 30-50% less area and 70% less thickness than an equivalent DIP. This package has gull-wing type pins protruding from the two long sides, with a pin pitch of 0.05 inches.
Small-Outline Integrated Circuit (SOIC) and PLCC packages. in the 1990s, although PGA packages were still frequently used for high-end microprocessors. pQFP and thin small-outline package (TSOP) became the usual packages for high pin-count devices. intel and AMD's high-end microprocessors were built from PQFPs. Intel and AMD moved from PGA (Pine Grid Array) packages to Land Grid Array (LGA) packages for their high-end microprocessors.
Ball Grid Array packages have been around since the 1970s, and in the 1990s crystal-covered Ball Grid Array packages were developed that had more pins than other packages. In FCBGA packages, the die is flipped up and down and connected to the solder balls on the package through a base layer similar to a PCB, rather than a wire.FCBGA packages allow the array of input and output signals (called the I/O area) to be distributed over the entire surface of the chip, rather than being confined to the periphery of the chip. In today's market, the package has also been a separate piece of the puzzle, and the technology of the package affects the quality and yield of the product.
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